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IPO SnapShot

IPO SnapShot

Bondada Engineering Ltd.

Issue Open Date 18-Aug-23  
Issue Closing Date 22-Aug-23  
Application Money 100  
Allotment Money  
Price Band (Rs.) 75 -  
Minimum Bid Quantity. 1600  
Issue Size (Shares) 5696000  
Market Lot 1  

Objective :

1. To meet long-term working capital requirements.2. General Corporate Purposes.

Business Description

We provide passive telecom infrastructure services which include turnkey services for cell site construction,erection, operation and maintenance of telecom towers with civil, elec...

Promoter's Holding

Total Share Capital   13680000  
Offered to Public   5696000  
Promoter's Holding (Pre-Issue)   86  
Promoter's Holding (Post-Issue)    
Address
Plot No-1-1-27/37
Ashok Manoj Nagar
Kapra
Hyderabad ,
Telangana ,
500062
Phone : 7207034662 / 8099366546
Email : info@bondada.net / cs@bondada.net
Website : www.bondada.net
Registrar
K FIN Technologies Ltd.-(Karvy Fintech Pvt Ltd.)
Karvy Selenium Tower B
Plot 31-32
Gachibowli
Financial District
Nanakramguda
Hyderabad
Listed at
BSE
Lead Manager
Vivro Financial Services Pvt Ltd
Promoters
Neelima Bondada
Raghavendra Rao Bondada
Satyanarayana Baratam